Experts from the National Institute of Steel Technology of Russia (NUST MISIS) have created a new type of composite material that has several times better thermal conductivity than comparable materials and is easy to process. The use of this material in modern electronics can solve the problem of overheating of printed circuit boards during operation.

Operating in the case of long-term overheating is not only easy to cause a crash, but electronic products are also prone to aging. The most sensitive part of a computer or smartphone for temperature rise is the processor and graphics card. High temperatures can shorten the stable operating period of both and even cause malfunctions.

To solve this problem, the college experts decided to make cheap and lightweight composite materials with high thermal conductivity and good mechanical properties. Demetri Muratov, a senior researcher in functional nanosystems and high-temperature materials, explains, "Our goal is a thermally conductive, non-conducting, polymer-based material that has the potential to be cheaper than common products." It will be able to effectively replace the glass cloth composite used in modern electronic products.

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